Microsoft says it has successfully tested a microfluidic system that routes liquid directly through channels etched into silicon, removing heat up to three times more effectively than today’s cold plates and reducing peak GPU temperature rise by 65% in lab-scale trials. The company used AI to map chip hot spots and collaborated with Swiss startup Corintis on a bio-inspired channel design, part of a broader infrastructure push that includes more than $30 billion in capital spending this quarter. Executives argue the approach could improve power usage effectiveness, enable higher server density and selective overclocking, and pave the way for future 3D chip architectures, while acknowledging hurdles in manufacturing, packaging, and reliability. Microsoft plans to explore integrating the technology into future Maia and Cobalt silicon and to work with fabrication partners to bring microfluidics into production across its datacenters.
Related articles:
